PRODUCT

NORDSON EDI Polystyrene (XPS) Foam Board Dies

Features:

Optional purge box feature allows for die maintenance to be carried out while the extruder is temporarily shut down
Proprietary coating allows the XPS polymer to flow without degradation or adhesion to the internal die wall


Department: ELECTRONICS APPLICATIONS DEPT (EAD)
Brand: Nordson EDI
Model Num:
CONTACT US

Singapore

Kenda Singapore Pte Ltd
67 Loyang Way
Singapore 508757
Reg. No: 197801740K

Tel: (65) 6543-1183

Fax: (65) 6543-1182

General Sales Inquiries

KendaSing@kenda.net

Technical Support

TechSupport@Kenda.net

Indonesia

Kenda Indonesia JI Professor, Dr. Latumeten, Kompleks Grogol Permai Blok A, No. 24, Jakarta 11460, Indonesia

Email: KenIndo@kenda.net

Thailand

Kenda Technologies (Thailand) Ltd, Level 8, Zueling House, 1 Silom Road, Bangkok 10500, Thailand

Email: KenThai@kenda.net

Malaysia

Ken-Med Sdn Bhd, 568-10-44 Kompleks Mutiara, 3-1/2 Miles Jalan Ipoh, 51200 Kuala Lumpur, Malaysia

Email: KenMal@kenda.net

Philippines

Kenda Technologies Pte Ltd, 67 Loyang Way, Singapore 508757

Email: KenPhil@kenda.net

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